As the mother of electronic products, PCB industry also due to poor terminal market conditions and a small decline in market size. Fortunately, from 2024 PCB market size will resume year-on-year growth, which IC carrier board as the key substrate for advanced packaging of integrated circuits, the next five years, the growth rate will lead the rise.
According to the research organization Prismark estimates that the global PCB output value of $78.367 billion in 2023, compared with $81.741 billion in 2022, down 4.13%, but from 2024 onwards will return to year-on-year growth, 2023 to 2027 average annual compound growth rate of 3.8%.
As for the product line category, the PCB industry in 2023 includes RPCB multilayer boards, flexible boards + modules, and HDI,ICCarrier boards, the four major product lines output value will be a full-line recession. Among them: RPCB multilayer board output value ranked first, amounted to 37.34 billion U.S. dollars, compared with the 2022 recession of 3.57%; IC carrier board output value of 16.073 billion U.S. dollars, compared with the 2022 recession of 7.71%, the largest decline; flexible board + module output value of 13.427 billion U.S. dollars, compared with the previous year's recession of 3%; HDI output value of 11.528 billion U.S. dollars, compared with the previous year's recession of 2%.
Despite the recession in 2023, the market is generally expected to stabilize and demand will gradually recover from the second half of 2023 or 2024 onwards. Prismark's forecast data also shows that the entire product line will return to positive growth from 2024 onwards, with the four major product lines growing at a compound annual growth rate of 3.1%, 3.5%, 4.4%, and 5.1%, respectively, from 2023 to 2027.
It is not difficult to find that IC carrier board as a key substrate for advanced packaging of integrated circuits, with potential growth space.
IC carrier board is developed on the basis of PCB board technology, which is used to establish the signal connection between IC and PCB, and also plays the role of protecting the circuit, fixing the line and dissipating the residual heat. It is characterized by high density, high precision, miniaturization and thinness: in the field of high-level packaging, IC carrier board has replaced the traditional lead frame, become an indispensable part of the chip package, not only for the chip to provide support, heat dissipation and protection; and at the same time for the chip and the PCB motherboard to provide an electronic connection between the motherboard, playing the role of the "top and bottom". The role of the
According to the analysis, IC carrier board industry due to the past few years of high growth, but this year's demand is not good, resulting in this year's recession is more significant. And with the market demand expected to pick up in 2024, IC carrier boards may usher in new opportunities.
The market pattern of IC carrier board was first led by Japanese manufacturers, and then the production capacity followed the semiconductor industry chain partially transferred to China, Taiwan and South Korea. In recent years, by the impact of South Korea and China Taiwan manufacturers, Japanese companies to withdraw from the low-end market, to FC BGA, FC CSP and other high-end packaging substrates. At present, the top three IC carrier board companies for China and Taiwan's Xinxing Electronics, Ibiden, Samsung Electro-Mechanics, respectively, occupy 15%, 11%, 10% market share.
Overall, China and Taiwan enterprises product line is more comprehensive, while the Chinese mainland enterprises are still concentrated in the entry class and general class, is now actively importing high-end series of products. According to incomplete statistics, has laid out the IC carrier board business of China's local PCB companies are (in no particular order): Xing Sen Technology, Deep South Electric Road, Zhuhai Yueya, Jingwang Electronics, Chonda Technology, Bo Min Electronics, Kexiang shares, in the King Electronics, Dongshan Precision and so on.
